Samsung Electronics has secured a chip manufacturing contract worth more than $200 billion from Broadcom Inc. as both companies seek to expand their presence in the artificial intelligence infrastructure market (25/07).

The five-year agreement will run through 2030 and will focus on Samsung's 2-nanometer and below process technologies for Broadcom's products, Samsung said in a statement on Saturday.

The deal also expands the companies' strategic collaboration in memory and foundry technology.

Samsung and Broadcom Sign Five-Year Chip Manufacturing Agreement

Samsung said the contract will support Broadcom's products with its advanced manufacturing technologies over the next five years.

The agreement strengthens cooperation between the two companies in both memory and foundry businesses.

Partnership Focuses on 2nm Technology and AI Chip Production

Samsung said it will support Broadcom's next-generation AI accelerators through its memory business.

The collaboration is also expected to include advanced packaging technologies based on Samsung's 2nm process, including 2.3D and 2.5D integration, to deliver higher-performance and more power-efficient AI and networking silicon.

South Korea Expands Push for Global AI Semiconductor Leadership

Samsung and South Korean chipmaker SK Hynix Inc. are accelerating efforts to secure more global AI chip orders as competition increases from rivals such as Taiwan Semiconductor Manufacturing Co.

South Korea aims to double its memory production capacity within five years and secure world-class manufacturing capabilities to strengthen its position against competing countries.

AI Partnerships Announced During President Lee's Silicon Valley Visit

South Korean President Lee Jae Myung is visiting Silicon Valley to attend an AI summit.

Several technology agreements are being announced during the visit, including partnerships involving Nvidia Corp., South Korea's Naver Corp., and SK Hynix Inc.

PHOTO: UNSPLASH

This article was created with AI assistance.

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