The Ministry of Industry (Kemenperin) reaffirmed its commitment to accelerating the Indonesia semiconductor industry, emphasizing the development of a national chip design ecosystem as a foundation for industrial transformation and technological independence (13/01).

This initiative aligns with President Prabowo Subianto’s directive to strengthen the national industrial structure and deepen innovation-based downstream processing.

Minister of Industry Agus Gumiwang Kartasasmita highlighted that the ministry’s involvement in chip design development has been a consistent effort over the past several years.

“Over the last five years, Kemenperin has actively taken initiatives to be directly involved in chip design development,” Agus said after meeting with the Indonesia Chip Design Collaborative Center (ICDeC) in Jakarta (13/01).

He noted that the ministry began its efforts in 2019 and continued during Hannover Messe 2023, where Indonesia started establishing communication and exploring collaboration with global semiconductor industry players.

ICDeC: Building Human Resources and Technology

ICDeC is a non-profit organization focused on developing human resources and integrated circuit (chip) technology in Indonesia.

The Ministry of Industry played a key role as an initiator when ICDeC was established in 2023.

The center now gathers representatives from 16 universities with expertise in chip design, reflecting a coordinated national effort to strengthen semiconductor talent and innovation.

Global Partnerships and R&D in Indonesia

During Hannover Messe 2023, Kemenperin conducted preliminary talks with several global technology companies as part of Indonesia’s strategy to enter the global semiconductor value chain through a realistic and measured approach.

The ministry also signed a memorandum of understanding (MoU) with Apple, covering research and development (R&D) activities in Indonesia through collaboration with ICDeC.

The partnership emphasizes developing national human resources and optimizing local content levels (TKDN).

“This cooperation confirms that Indonesia is not only a market, but is also beginning to build capabilities as part of the global innovation ecosystem, particularly in chip design development,” Agus said.

Infrastructure and Policy Support

Kemenperin expressed appreciation to Bappenas for including the chip design program in its Blue Book, implemented via ICDeC. This reflects cross-ministerial alignment and integration into national development planning.

To support the roadmap, the ministry has allocated a dedicated floor at the Indonesia Manufacturing Center (IMC) for collaboration on research, development, and innovation in chip design.

Over the last five years, the ministry has also expanded infrastructure to support chip design R&D and testing, ensuring designs meet industry standards.

Indonesia Semiconductor Summit 2026

As part of efforts to strengthen the ecosystem and raise national awareness of semiconductors, Minister Agus is scheduled to be a keynote speaker at the Indonesia Semiconductor Summit 2026, held on 29–30 January at ITB Innovation Park, Bandung.

The forum will unite government, industry, academics, and global partners to discuss policy directions, development roadmaps, and collaboration opportunities.

“Forums like the Indonesia Semiconductor Summit are strategic spaces to unify vision, align policies, and strengthen cross-stakeholder collaboration,” Agus said.

PHOTO: MINISTRY OF INDUSTRY

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