Samsung Electronics and ASML have expanded their long-standing strategic partnership on High NA EUV lithography and advanced semiconductor manufacturing technologies to support the next generation of innovation in the AI era (8/9).

The companies will work together to accelerate the development and deployment of technologies designed to meet the growing performance and efficiency requirements of advanced semiconductor manufacturing.

Samsung Joins 12-Inch Photomask Initiative

Samsung will join an industry initiative focused on developing next-generation 12-inch photomask technology for future semiconductor manufacturing.

The semiconductor industry has used the 6-inch photomask format for decades. With High NA EUV, the shift to larger 12-inch masks is expected to increase fab productivity, reduce chipmaking costs and remove stitching constraints.

The transition is intended to help advanced chip manufacturers fully use the benefits of High NA EUV and make future generations of leading-edge chips more cost-effective.

Samsung said its experience in memory and foundry manufacturing, along with its extensive experience with advanced EUV lithography, positions the company to play an important role in the transition to 12-inch photomasks.

The company will work closely with industry partners to develop the required mask technologies and supporting infrastructure.

Samsung Plans High NA EUV for DRAM by 2028

Samsung also plans to introduce ASML’s High NA extreme ultraviolet (EUV) lithography into future DRAM high-volume manufacturing by 2028.

The move would make Samsung the first company in the industry to use High NA EUV in DRAM high-volume manufacturing, according to the announcement.

High NA EUV is expected to extend the DRAM scaling roadmap. Its improved resolution is expected to enable process simplification and increase efficiency.

The technology is also expected to support advanced memory and logic applications.

Samsung and ASML Strengthen Semiconductor Collaboration

The expanded partnership builds on years of cooperation between Samsung and ASML and reflects their shared commitment to innovation, technology leadership and long-term collaboration.

Young Hyun Jun, Vice Chairman and CEO of Samsung Electronics, said: “The AI era is transforming the semiconductor industry and increasing the importance of technological innovation across the entire value chain. Samsung is committed to maintaining leadership in advanced semiconductor manufacturing, including memory and foundry, through breakthrough technologies and strong partnerships. By further strengthening our collaboration with ASML, we are helping lay the foundation for the next generation of AI and semiconductor innovation.”

Christophe Fouquet, President and Chief Executive Officer of ASML, said: “Samsung has been one of ASML’s most important innovation partners for many years. Together, we have helped advance the technologies that underpin modern semiconductor manufacturing. As the industry enters a new era driven by artificial intelligence, close collaboration with our customers becomes even more important. We look forward to working with Samsung to enable the next wave of semiconductor innovation.”

Samsung and ASML expect to continue exploring opportunities for collaboration in areas including advanced memory and innovative manufacturing approaches.

PHOTO: SAMSUNG, ASML

This article was created with AI assistance.

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